VULNERABILITY INTELLIGENCE

CVE-2023-33063

CVSS score7.8 HIGH
EPSS probability0.67%
CISA KEVKnown exploited vulnerability
Published2023-12-05
Last modified2026-06-17
CVSS vectorCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Known Exploited Vulnerability

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Vendor / product: Qualcomm / Multiple Chipsets

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Weakness classification

  • product-security@qualcomm.com: CWE-416
  • nvd@nist.gov: CWE-416

Primary references