VULNERABILITY INTELLIGENCE

CVE-2022-22071

CVSS score8.4 HIGH

EPSS probability0.41%

CISA KEVKnown exploited vulnerability

Published2022-06-14

Last modified2026-06-17

CVSS vectorCVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Known Exploited Vulnerability

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Vendor / product: Qualcomm / Multiple Chipsets

Description

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music

Weakness classification

nvd@nist.gov: CWE-416
134c704f-9b21-4f2e-91b3-4a467353bcc0: CWE-416

Primary references

product-security@qualcomm.com — Patch, Vendor Advisory
af854a3a-2127-422b-91ae-364da2661108 — Patch, Vendor Advisory
134c704f-9b21-4f2e-91b3-4a467353bcc0 — US Government Resource