VULNERABILITY INTELLIGENCE
CVE-2019-2306
CVSS score7.8 HIGH
EPSS probability0.22%
CISA KEVNot currently listed
Published2019-07-25
Last modified2026-06-17
CVSS vectorCVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Description
Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20
Weakness classification
- nvd@nist.gov: CWE-125
Primary references
- product-security@qualcomm.com — Patch, Third Party Advisory
- af854a3a-2127-422b-91ae-364da2661108 — Patch, Third Party Advisory