VULNERABILITY INTELLIGENCE
CVE-2019-2303
Description
SNDCP module may access array out side its boundary when it receives malformed XID message. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8976, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, SC8180X, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, Snapdragon_High_Med_2016, SXR1130, SXR2130
Weakness classification
- CWE-125: Out-of-bounds Read
Primary references
- product-security@qualcomm.com — Vendor Advisory
- af854a3a-2127-422b-91ae-364da2661108 — Vendor Advisory