VULNERABILITY INTELLIGENCE
CVE-2019-14093
CVSS score7.8 HIGH
EPSS probability0.21%
CISA KEVNot currently listed
Published2020-07-30
Last modified2026-06-17
CVSS vectorCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Description
Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20
Weakness classification
- nvd@nist.gov: CWE-129
Primary references
- product-security@qualcomm.com — Broken Link
- nvd@nist.gov — Patch, Vendor Advisory
- af854a3a-2127-422b-91ae-364da2661108 — Broken Link